Henkel adhesives have been enabling consumer device designs for decades. We know what it takes to build handheld devices (smartphones, tablets, and laptops), wearables and hearables that look beautiful, and function with the dependability that consumers’ demand.

Underneath the sleek, sophisticated exterior are reliable, rugged, resilient devices. You can’t see Henkel’s PUR hot melt structural adhesives, protective coatings and encapsulants, or our award-winning thermal management materials, but they are vital to today’s consumer device aesthetics and performance.

As electronics manufacturers seek to expand global footprints, shift production locales, and meet growing consumer demand across South Asia, getting up and running — and getting it right the first time – is imperative.

We’ve been doing this for a long time. We know what works and what doesn’t. We’ve developed the market’s most innovative and effective electronic materials to help you get it right.

The Materials that Build Enduring Connections

• Building Durable Electronics with Structural Adhesives: Structural adhesives offer a pathway to enhancing the structural integrity and durability of consumer electronics. By utilizing these advanced adhesives, designers can achieve strong, reliable bonds that withstand physical impacts and environmental stresses. This is particularly important for sleek, miniaturized devices that demand both aesthetic appeal and rugged durability. Integrating these adhesives into the design process ensures that devices not only look good but are also built to last, meeting consumer expectations for long-term performance and reliability.
• Enhancing Consumer Electronic Devices with Board-Level Encapsulants: By leveraging the information from the board-level encapsulants document, designers can significantly enhance the durability and reliability of their consumer electronic devices. Encapsulants protect sensitive components from environmental threats like dust, moisture, and mechanical shocks. By integrating these materials into device designs, engineers can ensure that their products maintain optimal performance under various conditions, thereby reducing failure rates and extending the product’s lifespan.
• Strengthening Devices with Board-Level Underfills: The insights on board-level underfills offer valuable strategies for improving the mechanical integrity of electronic devices. Designers can use underfills to reinforce solder joints, providing enhanced protection against mechanical shocks and thermal cycling. This not only improves the overall durability of the device but also enhances its performance and reliability, especially in applications where devices are exposed to physical stress or fluctuating temperatures. Implementing these materials can lead to more robust and reliable consumer electronics.
• Optimizing Device Performance with Thermal Management Materials: The document on thermal management materials is crucial for designers looking to optimize the performance and longevity of their devices. By incorporating advanced thermal interface materials, designers can efficiently manage and dissipate heat generated by high-performance components. This helps in maintaining safe operating temperatures, preventing overheating, and ultimately extending the life of the device. Effective thermal management is key to ensuring devices operate smoothly and reliably, even under heavy use.

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